SummaryThe tinned copper foil made by Telison replaced the bus bar ribbon and used on stacked wafer module and Thin-film module.
CharacteristicsThe tinned copper foil applied to high efficiency stacked wafer module (punching tinned copper foil) or Thin-film module(tinned copper foil). It can reduce the fragmentation and crack rate of the cell, improve the module reliability under TC status and service life.
? 2016-2025 Xi'an Tai song new materials Limited by Share Ltd Copyright 14004094 ICP preparation of Shaanxi -1