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Tinned Copper Foil

Release time: 2016-07-19 10:36:18 Click: 855
SummaryDescriptionCharacteristics

Summary

The tinned copper foil made by Telison replaced the bus bar ribbon and used on stacked wafer module and Thin-film module.

Description

Characteristics

The tinned copper foil applied to high efficiency stacked wafer module (punching tinned copper foil) or Thin-film module(tinned copper foil). It can reduce the fragmentation and crack rate of the cell, improve the module reliability under TC status and service life.

? 2016-2025 Xi'an Tai song new materials Limited by Share Ltd Copyright 14004094 ICP preparation of Shaanxi -1

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